SD NAND转接板|SD NAND测试板|

SD NAND Test Board

Applicable Products: LGA8, 6x8/6.2*8/7*8.5mm SD NAND products. Test Board Dimensions: Length 6.22 cm, Width 2.49 cm, Interface Length 2.53 cm. Instructions: Solder the chip onto the test board. It can be directly debugged and tested on the original Micro SD card slot. Preparation Tools: Heat gun, solder paste, tweezers. Temperature Requirement: Set the heat gun temperature to 350°C for soldering.

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SD NAND Test Board User Manual:

Applicable Products: LGA8, 6x8/6.2*8/7*8.5mm SD NAND products.

Test Board Dimensions: Length 6.22 cm, Width 2.49 cm, Interface Length 2.53 cm.

Instructions: Solder the chip onto the test board. It can be directly debugged and tested on the original Micro SD card slot.

Preparation Tools: Heat gun, solder paste, tweezers.

Soldering Instructions:

First, use a soldering iron to tin the 8 PINs of the chip. The middle PIN should remain untinned and left as NC (No Connection).

Then, tin the corresponding 8 PINs on the adapter board.

Finally, use tweezers to place the chip onto the PCB. Adjust the hot air gun to 350℃ and evenly heat the surface of the chip to complete the soldering process.

Other Notes: Other components on the test board can be ignored. Simply solder the chip onto the test board and debug it as an SD card.

After soldering, insert the adapter board into a card reader. Connect the card reader to a computer to check if the capacity is correctly recognized. This method helps verify whether the chip has been soldered correctly.

Test Board Effect Diagram:

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